TSSOP-20_P0.65mm

SOIC (dual-row SMD) 20 pads mm Courtyard: 8.25×7.3

TSSOP-20, 4.4 mm body, 0.65 mm pitch.

Pads

#	x	y	w	h	shape	type	layer	drill
1	-2.875	-2.925	1.5	0.45	roundrect	smd	top	—
2	-2.875	-2.275	1.5	0.45	roundrect	smd	top	—
3	-2.875	-1.625	1.5	0.45	roundrect	smd	top	—
4	-2.875	-0.975	1.5	0.45	roundrect	smd	top	—
5	-2.875	-0.325	1.5	0.45	roundrect	smd	top	—
6	-2.875	0.325	1.5	0.45	roundrect	smd	top	—
7	-2.875	0.975	1.5	0.45	roundrect	smd	top	—
8	-2.875	1.625	1.5	0.45	roundrect	smd	top	—
9	-2.875	2.275	1.5	0.45	roundrect	smd	top	—
10	-2.875	2.925	1.5	0.45	roundrect	smd	top	—
11	2.875	2.925	1.5	0.45	roundrect	smd	top	—
12	2.875	2.275	1.5	0.45	roundrect	smd	top	—
13	2.875	1.625	1.5	0.45	roundrect	smd	top	—
14	2.875	0.975	1.5	0.45	roundrect	smd	top	—
15	2.875	0.325	1.5	0.45	roundrect	smd	top	—
16	2.875	-0.325	1.5	0.45	roundrect	smd	top	—
17	2.875	-0.975	1.5	0.45	roundrect	smd	top	—
18	2.875	-1.625	1.5	0.45	roundrect	smd	top	—
19	2.875	-2.275	1.5	0.45	roundrect	smd	top	—
20	2.875	-2.925	1.5	0.45	roundrect	smd	top	—

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